R631DF

Special Grinder for Hard but Brittle Wafers.
High-Precision Grinder to replace lapping machines.
Fully Automated Cassette to Cassette Operetion.
Grinding Parameters of Each Wafer can be stored.


Grinding Capacity
O.D. (Min.~Max.)
[mm]
MAX.φ200mm
I.D. (Min.~Max.)
[mm]
-
Thickness
[mm]
2.5mm
Grinding Wheel
O.D. (Min.~Max.)
[mm]
MAX.φ305mm
I.D. (Min.~Max.)
[mm]
-
Width
[mm]
0mm
Floor Space
W x D
[mm]
1,690 x 2,720mm
Machine Weight
[Kg]
6,000Kg